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簡介
華亞科技為一先進晶圓製造廠，使用最先進300 mm技術及以193nm波長掃描的深紫外線邊緣切割技術以及先進的溝槽式乾蝕刻製程技術。
目前生產產品
90 nm 512 Mb DDR SDRAM
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Process Technology |
90 nm with deep trench capacitor |
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Organization |
x4, x8, x16 |
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Burst Length |
2, 4, or 8 |
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CAS Latency |
2, 2.5 and 3 |
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Power Supply |
2.5V +/- 0.2V |
90 nm 512 Mb DDR2 SDRAM
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Process Technology |
90 nm with deep trench capacitor |
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Organization |
x4, x8, x16 |
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Burst Length |
4 or 8 |
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CAS Latency |
3, 4 and 5 |
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Power Supply |
1.8V +/- 0.1V |
90 nm 1Gb DDR2 SDRAM
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Process Technology |
90 nm with deep trench capacitor |
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Organization |
x4, x8, x16 |
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Burst Length |
4 or 8 |
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CAS Latency |
3, 4 and 5 |
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Power Supply |
1.8V +/- 0.1V |
備註: 75奈米溝槽式製程技術產品，目前由奇夢達與南亞科技共同研究開發當中。
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